Experimental validation of formula for calculation thermal diffusivity in superlattices performed using a combination of two frequency-domain methods: Photothermal infrared radiometry and thermoreflectance

Pawlak, M. and Kruck, T. and Spitzer, N. and Dziczek, D. and Ludwig, Ar. and Wieck, A.D.

Volume: 11 Pages:
DOI: 10.3390/app11136125
Published: 2021

In this paper, we validate two theoretical formula used to characterize thermal transport of superlattices at different temperatures. These formulas are used to measure cross-plane thermal conductivity and thermal boundary resistance, when it is not possible to obtain heat capacity or thermal diffusivity and in-plane thermal conductivity. We find that the most common formula for calculating thermal diffusivity and heat capacity (and density) can be used in a temperature range of −50 °C to 50 °C. This confirms that the heat capacity in the very thin silicon membranes is the same as in bulk silicon, as was preliminary investigated using an elastic continuum model. Based on the obtained thermal parameters, we can fully characterize the sample using a new procedure for characterization of the in-plane and cross-plane thermal transport properties of thin-layer and superlattice semiconductor samples. © 2021 by the authors. Licensee MDPI, Basel, Switzerland.

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