Unveiling the interface characteristics and their influence on the heat transfer behavior of hot-forged Cu–Cr/Diamond composites

Jia, S.Q. and Bolzoni, L. and Li, T. and Yang, F.

Volume: 172 Pages: 390-401
DOI: 10.1016/j.carbon.2020.10.036
Published: 2021

Cu–Cr/55 vol% diamond composites with 1 wt % (Cu–1Cr/55Dia), 2 wt % (Cu–2Cr/55Dia), and 3 wt % (Cu–3Cr/55Dia) Cr additives, respectively, are fabricated by a hot forging method. The diamond particle surfaces are nearly completely covered by the formed carbides interface for the Cu–3Cr/55Dia composite, and the Cu–3Cr/55Dia has the highest measured thermal conductivity among the three fabricated composites (433 Wm−1K−1). High Resolution Transmission Electron Microscopy analyses suggest that a double-layered interface structure is formed between the copper matrix and the diamond particle in the Cu–3Cr/55Dia, which is composed of 160 nm-thick Cr3C2 and 2 nm-thick Cr23C6. This interface structure, together with high relative density of the composite, high interface coverage of diamond, thin interface layer, and formation of coherent atomic boundaries, significantly contributes to obtaining high thermal conductivity for the Cu–3Cr/55Dia composite. The Diffuse Mismatch Model and Differential Effective Medium model are modified for establishing the quantitative relationship among interface characteristics, interface thermal conductance, and the composite's thermal conductivity, based on considering the composite's interface structure and phonon transmission theory. The predicted thermal conductivity value is well matched with the measured value for the Cu–3Cr/diamond (487 Wm−1K−1 vs 433 Wm−1K−1). This helps understand heat transfer behavior in the Cu–Cr/diamond composites. © 2020 Elsevier Ltd

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