Corrigendum to: SiO 2 microstructure evolution during plasma deposition analyzed via ellipsometric porosimetry (Plasma Processes and Polymers, (2019), 16, 9, (1900015), 10.1002/ppap.201900015)

Buschhaus, R. and von Keudell, A.

Volume: 17 Pages:
DOI: 10.1002/ppap.202000036
Published: 2020

The paper by Rahel Buschhaus and Achim von Keudell, published online on 2 April 2019 and in issue 9, 2019, e1900015 (, contains some errors the authors wish to correct. These errors were: (i)The substrate holder was not placed at the opposing end of the plasma line, instead the holder was surrounding the plasma line concentrically. The sample was placed on the substrate holder at a distance of 3.7 cm from the plasma line. (ii)The pressure in the MW process was 25 Pa instead of 100 Pa. This implies different values in Table 1 and a four times larger mean free path in the MW process. (iii)The SEI values in Table 1 are changed because the flow was improperly used in the calculation. The correct Table 1 is as follows: (Table presented.) These errors do not affect significantly the reasoning in the manuscript and the main conclusions remain valid. The authors apologize for any inconvenience caused. © 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

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