Publications

Method for conducting in situ high-temperature digital image correlation with simultaneous synchrotron measurements under thermomechanical conditions

Rossmann, L. and Sarley, B. and Hernandez, J. and Kenesei, P. and Köster, A. and Wischek, J. and Almer, J. and Maurel, V. and Bartsch, M. and Raghavan, S.

REVIEW OF SCIENTIFIC INSTRUMENTS
Volume: 91 Pages:
DOI: 10.1063/1.5124496
Published: 2020

Abstract
This work presents a novel method of obtaining in situ strain measurements at high temperature by simultaneous digital image correlation (DIC), which provides the total strain on the specimen surface, and synchrotron x-ray diffraction (XRD), which provides lattice strains of crystalline materials. DIC at high temperature requires specialized techniques to overcome the effects of increased blackbody radiation that would otherwise overexpose the images. The technique presented herein is unique in that it can be used with a sample enclosed in an infrared heater, remotely and simultaneously with synchrotron XRD measurements. The heater included a window for camera access, and the light of the heater lamps is used as illumination. High-temperature paint is used to apply a random speckle pattern to the sample to allow the tracking of displacements and the calculation of the DIC strains. An inexpensive blue theatrical gel filter is used to block interfering visible and infrared light at high temperatures. This technique successfully produces properly exposed images at 870 °C and is expected to perform similarly at higher temperatures. The average strains measured by DIC were validated by an analytical calculation of the theoretical strain. Simultaneous DIC and XRD strain measurements of Inconel 718 (IN718) tensile test specimens were performed under thermal and mechanical loads and evaluated. This approach uses the fact that with DIC, the total strain is measured, including plastic strain, while with XRD, only elastic strain is captured. The observed differences were discussed with respect to the effective deformation mechanisms. © 2020 Author(s).

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